High-Performance Thermal Materials for Next-Generation Electronics

With the increasing demand for higher power density and miniaturized electronic systems, efficient thermal management has become critical to maintaining device performance and long-term reliability.

Singleton engineers advanced thermal interface materials (TIMs) based on graphene and boron nitride formulations, delivering solutions featuring:

• High thermal conductivity

• Low thermal resistance

• Excellent interface conformity

• Long-term reliability

Singleton provides advanced thermal interface solutions designed to address the increasing thermal challenges of high-performance electronic systems. Our thermal interface pads are designed for demanding applications including optical modules, semiconductor devices, AI computing systems, servers, telecom equipment, and new energy vehicle(NEV) electronics.

1. Graphene Thermal Pad

High Thermal Conductivity & Low Thermal Resistance

Through advanced orientation-controlled processing, graphene fillers are vertically aligned to create efficient thermal conduction pathways.

• Thermal conductivity up to 130 W/m·K

• Thermal resistance as low as 0.06 ℃·cm²/W

• Excellent interfacial contact performance

• Effective gap filling for improved heat transfer

The flexible structure enables reliable thermal contact in thin and highly integrated electronic devices.

High Elastic Recovery & Assembly Compatibility

Designed with a flexible, high-resilience structure:

• Elastic recovery rate ≥55%

• Low-pressure compression enables intimate contact with uneven or irregular interfaces.

• Maintains excellent shape recovery capability, enhancing product reliability and extending service life after prolonged use

Low Oil Bleeding and Low Volatility for High-Cleanliness Applications

Compared with conventional silicone-based thermal pads, this material demonstrates significant advantages in:

• Low volatility and low migrationcharacteristics

• Reduced silicone oil contamination risk

Long-Term Reliability for High-Power Applications

With excellent thermal stability and mechanical durability, the graphene thermal interface pad supports continuous operation under demanding conditions. It effectively:

• Improves heat dissipation efficiency

• Reduces thermal failure risks

• Enhances system reliability

2. Boron Nitride Thermal Pad

Optimized Thermal Conduction Network

Using advanced filler orientation technology, vertically aligned hexagonal boron nitride (h-BN) creates efficient through-plane thermal pathways.

• 3D thermal conduction network

• Enhanced heat transfer efficiency

• Improved temperature uniformity

• Reduced hotspot formation

High Thermal Performance & Low Thermal Resistance

The optimized material structure delivers:

• Thermal conductivity up to 25 W/m·K

• Excellent interfacial conformity

• Reduced air-gap thermal resistance

• Stable thermal performance in thin-profile applications

Low Density and Volatility for Lightweight Applications

The material combines lightweight design with efficient thermal conduction capability. Key advantages include:

• Low density

• Low volatility

• Low oil migration

• Excellent environmental stability

Long-Term Reliability and Excellent Aging Resistance

The stable material structure provides excellent resistance against aging-related degradation.

• Performance variation remains below 10% after long-term aging tests

Reliable Thermal Management for Future Electronics

Singleton’s graphene and boron nitride thermal interface pads provide efficient heat transfer solutions for advanced electronic systems.

With continuous innovation in thermal materials and manufacturing technologies, Singleton provides high-performance, customized thermal management solutions for customers worldwide.