With the rapid evolution of new energy systems, AI computing platforms, and optical communication devices, electronics are becoming increasingly compact, powerful, and highly integrated. However, rising power density and concentrated heat generation are creating critical thermal management challenges that impact system reliability and lifetime.

Traditional thermal solutions are no longer sufficient for next-generation electronic devices. Singleton introduces a new generation of high-performance thermal gel solutions, designed to deliver efficient heat transfer, stress relief, long-term reliability, and production scalability for demanding applications.

1. Overcoming the Limitations of Traditional Thermal Materials

As electronic systems become more compact and powerful, thermal interfaces must withstand increasingly demanding operating conditions:

Automotive electronics: High vibration, wide temperature fluctuations, and enclosed heat accumulation.

AI computing & optical modules: Extremely high heat flux, miniaturized components, and localized hotspot formation.

Traditional thermal materials face significant limitations:

Thermal Grease

1. Pump-out and migration during thermal cycling and vibration

2. Dry-out over long-term operation

3. Increased thermal resistance and reduced reliability

Conventional Thermal Pads

1. Limited adaptability to component height variations and assembly tolerances

2. Incomplete contact and air gap formation

3. Excessive mechanical stress on sensitive components

Conventional Thermal Gels

1. Insufficient thermal performance under high heat flux conditions

2. Limited capability for rapid heat spreading and hotspot suppression

The industry requires a flexible thermal solution that combines high thermal conductivity, excellent interface conformity, long-term stability, and manufacturing compatibility.

2. Singleton High-Performance Thermal Gel Series

To address both mass-production thermal requirements and high-end precision applications, Singleton introduces three thermal gel products:

SG TGL120DF – 12 W/m·K

SG TGL150DF – 15 W/m·K

SG TGL180 – 18 W/m·K

Based on a curable flexible thermal gel platform, these solutions provide:

✓ Efficient heat transfer

✓ Low assembly stress

✓ Excellent interface filling capability

✓ Long-term thermal reliability

✓ Compatibility with automated dispensing processes

SG TGL120DF & SG TGL150DF | Cost-Effective Solutions for High-Volume Manufacturing

SG TGL120DF

SG TGL150DF

Designed for large-scale applications, SG TGL120DF and SG TGL150DF achieve 12 W/m·K and 15 W/m·K thermal conductivity through Singleton’s proprietary ceramic filler technology.

Unlike diamond-filled thermal systems, the optimized filler structure provides lower equipment wear, reducing damage to dispensing needles and pumps while improving production efficiency.

Key Advantages

✓ High thermal performance with optimized cost efficiency

✓ Low filler hardness for reduced equipment abrasion

✓ Excellent dispensing performance for automated production

✓ Low assembly pressure for improved yield and reliability

Recommended Applications：Electric vehicle power electronics, Energy storage systems, Inverters, Charging infrastructure, Industrial power supplies.

SG TGL180 | 18 W/m·K Advanced Thermal Gel for High-End Applications

SG TGL180

SG TGL180 adopts an advanced composite filler system to create efficient thermal pathways, achieving 18 W/m·K thermal conductivity for rapid heat dissipation and hotspot control.

Its thixotropic characteristics enable excellent gap filling between power components, housings, and cooling plates, effectively eliminating interface air gaps and reducing contact thermal resistance.

Validated through rigorous reliability testing, SG TGL180 delivers stable thermal performance under:

1. High-temperature aging conditions

2. 85°C/85%RH humidity testing

3. Thermal shock cycling

Its low volatility, low bleeding formulation, and excellent electrical insulation performance make it suitable for highly sensitive applications.

Key Advantages

✓ 18 W/m·K high thermal conductivity

✓ Superior heat spreading and hotspot management

✓ Low-stress assembly for sensitive semiconductor devices

✓ Compatible with automated dispensing processes

✓ Excellent aging resistance and environmental stability

Recommended Applications: Optical communication equipment, AI computing infrastructure, High-performance EV electronics, Power semiconductors, Advanced energy storage systems, RF communication devices.

3. One Thermal Gel Platform, Multiple Application Scenarios

Singleton thermal gels combine flexibility, high thermal performance, and long-term reliability to meet the evolving demands of modern electronics.From cost-efficient mass production systems to high-performance precision devices, Singleton provides customized thermal management solutions for: Medium to high heat flux applications, High-density electronic systems, Harsh operating environments. By improving interface contact, accelerating heat transfer, and reducing thermal stress, Singleton thermal gel solutions help next-generation electronic devices achieve higher performance, greater reliability, and longer service life.